Paras Semiconductors BroadPak partnership will accelerate the development of advanced semiconductor packaging capabilities in India. Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has joined hands with US-based BroadPak Corporation.
The collaboration will combine Paras’ manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak’s technology expertise. Furthermore, it will focus on advanced packaging, heterogeneous integration and chiplet-based system architectures.
The companies aim to establish an advanced heterogeneous integration and 3D packaging facility. The proposed unit will operate as an Outsourced Semiconductor Assembly and Test (OSAT) facility in India.
Paras Semiconductors plans 2.5D and 3D packaging facility
The proposed facility will develop capabilities across several advanced packaging technologies. These include 2.5D and 3D packaging, chiplet integration and hybrid bonding.
Additionally, the facility will focus on wafer-level and panel-level fan-out packaging. It will also develop co-packaged optics and advanced semiconductor testing and qualification capabilities.
Paras Defence and Space Technologies is an Indian defence engineering company. It develops and manufactures indigenously designed, developed and manufactured products for defence and space applications.
BroadPak Corporation, headquartered in San Jose, California, provides advanced semiconductor packaging technologies. Founded in 2007, the company works across 2.5D and 3D IC packaging, heterogeneous integration and multi-die architectures.
Its capabilities also cover high-speed interconnects, thermal management and co-packaged optics. Furthermore, its services span architecture, design, simulation, assembly, testing and production.
Partnership includes technology transfer and chiplet integration
Under the agreement, Paras Semiconductors will access BroadPak’s advanced design, manufacturing and integration intellectual property. The collaboration will also include technology transfer and process know-how.
Specifically, the partners will focus on 2.5D and 3D packaging and chiplet integration. They will also explore joint development of advanced packaging platforms for artificial intelligence and high-performance computing applications.
Moreover, the companies plan collaborative training and skill development programmes for Indian engineers. These initiatives will support the development of domestic technical expertise.
The proposed facility will target high-volume manufacturing and strategic electronics requirements. Its applications will include semiconductor devices for optical and optronic systems.
Additionally, the facility will address demand from high-performance computing, networking and data centre applications.
Paras Defence expands into semiconductor technology
Commenting on the partnership, Munjal Sharad Shah, Managing Director of Paras Defence and Space Technologies, said the company’s entry into semiconductors marked a strategic expansion.
He said advanced semiconductor technologies were becoming increasingly important for India’s AI, data centre and industrial capabilities.
“Our collaboration with BroadPak brings the specialised technology expertise required to accelerate this ambition and develop capabilities that can serve both strategic domestic requirements and the wider semiconductor industry,” Shah said.
Meanwhile, Farhang Yazdani, Founder and CEO of BroadPak Corporation, said the company would contribute its expertise in advanced packaging technologies, engineering and manufacturing processes.
Advanced packaging gains importance in semiconductor industry
The partnership comes amid growing demand for advanced semiconductor packaging across the global electronics industry.
AI accelerators, graphics processing units (GPUs) and high-bandwidth memory are driving demand for more advanced computing architectures. Consequently, semiconductor companies are increasingly adopting chiplets, 2.5D and 3D integration, and hybrid bonding.
These technologies help improve computing performance, bandwidth and power efficiency. They also support thermal management in increasingly complex semiconductor systems.
The proposed Paras-BroadPak facility aims to develop domestic capabilities in this expanding segment of the semiconductor value chain.
